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Advanced Packaging Lead

About Us QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quan

Company

QuantWare

Location

Delft

Status

Open

Posted

2026-10-23T06:52:04.747+00:00

QuantWare is hiring an Advanced Packaging Lead in Delft to develop back-end fabrication and assembly for its multi-layer quantum processor chip stack. The role covers flip-chip bonding, contact reliability, UBM, bumps, hard-stops and detachable contacts, plus integration test plans, documented procedures and troubleshooting with cross-functional teams. The posting asks for 4+ years in chip assembly for deep-tech or low-volume technology, hands-on back-end process-flow experience, and a physics or microwave/RF/electrical engineering background; superconducting qubit experience and a PhD are pluses. Leadership of process development is distinctive.