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Photonic Packaging Engineer

About QuandelaQuandela is a global leader in photonic quantum computing, developing hardware and software technologies to build scalable and energy-efficient quantum systems.With more than 140 people, we develop our own stack, from semicond

In inglese

Company

Quandela

Location

Massy, Île-de-France, France

Status

Open

Posted

2026-09-28T00:00:00+00:00

Quandela seeks a Photonic Packaging Engineer for its Integrated Photonics team, on-site across Massy and Palaiseau. The engineer owns and improves packaging processes: optical coupling, precision alignment, fiber-array attachment, bonding, electrical interconnections, and thermal and mechanical integration. They build and characterize packaged PIC prototypes, set tolerances, document procedures, work with PIC designers and suppliers, and support automation. The posting asks for a master's or PhD in photonics, physics, engineering or microelectronics, hands-on photonic or semiconductor packaging experience, optical alignment and process qualification skills, and English. Quantum experience is not required.