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Design Engineer, Microelectronics Packaging

At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering.

In inglese

Company

IQM

Location

Tokyo, Japan

Status

Open

Posted

2026-09-14T16:09:15+00:00

IQM's Japan site is hiring a design engineer to develop the 3D integrated stack that carries microwave and DC signals into its quantum processing units at cryogenic temperatures. The work covers die packaging processes, PCB, ceramic, glass or silicon process requirements, and electrical and thermal characterization, done jointly with European teams and Japanese fabrication partners. The posting asks for a master's or PhD in experimental physics or electrical engineering, experience with bump bonding or RDL fan-out, package CAD tools and cryogenic measurement, plus fluent English and Japanese. It is the partner-facing technical link role that stands out.