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3D Packaging Engineer

About Us QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quan

In inglese

Company

QuantWare

Location

Delft

Status

Open

Posted

2026-10-27T14:30:13.639+00:00

QuantWare in Delft is hiring a 3D Packaging Engineer to turn its VIO quantum processor designs into assembled hardware. The work is hands-on: adapting flip-chip bonders and die-attach machines, tuning thermo-compression, laser-assisted and cold-welding processes, testing adhesives and solders against thermal cycling and cryogenic vacuum, and building multi-die stacks with interposers and vertical chip placement. The posting asks for a mechanical, mechatronics, physics or materials degree, 3–5 years on high-accuracy semiconductor assembly tools, and roughly 1 µm placement tolerances. It states that applicants need not meet every requirement.